Measurement of thermal boundary resistance by modulated infrared photothermal radiometry
Thermal transport across solid interfaces is characterized by the thermal boundary resistance (TBR) Rth, also known as Kapitza resistance, which is the reciprocal of the thermal boundary conductance Gth. Despite recent progress in the comprehension and modeling of heat transfer across interfaces, experimental values of the TBR in various systems present large deviations from theoretical predictions. Moreover, a large variability of Rth with the condition of the interface at micro- and nano-scale is observed. However, such data are necessary for the validation of theoretical models and computations. Measuring Rth between a film and the substrate is often a challenge for the experimentalist because the available methods have to be adapted to the features of the samples. This work presents the experimental approach using high frequency infrared photothermal radiometry (HF-PTR), the theory of the simulation model and the sensitivity analysis of four sets of samples. The first two sets (Set 1, 2) are representative for a metal – semiconductor interface with different doping levels of the substrates. Set 3 compares two different deposition speeds of a metallic film on a semiconductor or metal substrates. Set 4 illustrates a metal / graphene / semiconductor system. The current PTR system allows measurements up to 10 MHz, allowing Rth measurements for films thicknesses down to 50 nm. Rth is obtained after minimization of the deviation between the simulation model and the experimental data. A study of uncertainties led us to calculate the total experimental error ?Rth of the determined resistances.
This presentation has not yet been uploaded.
No handouts have been uploaded.
Georges Hamaoui (POC,Primary Presenter,Author), University of Reims Champagne-Ardenne, email@example.com;
Nicolas Horny (Co-Author), University of Reims Champagne-Ardenne, firstname.lastname@example.org;
Mihai Chirtoc (Co-Author), University of Reims Champagne-Ardenne, email@example.com;
Austin Fleming (Co-Author), Utah State University, firstname.lastname@example.org;
Heng Ban (Co-Author), Utah State University, email@example.com;