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5/16/2017  |   9:35 AM - 10:00 AM   |  3

Development of a 3-omega thermal conductivity measurement system for thin dielectric films with experimental validation

The 3-omega technique was developed 1990s for the measurement of thermal conductivity and diffusivity. The technique uses an AC power supply with frequency of omega and a lock-in amplifier to capture the voltage signal with frequency of 3-omega. The thermal conductivity can be calculated with high accuracy through detailed analysis of the signal combined with a physical model of the system. In order to guarantee high accuracy of the measurement of systems of unknown thermal conductivity, it is important to validate the accuracy of the 3-omega system with a known material. Several sets of experimental data of the thermal conductivity of a 300nm silicon nitride film were collected. By comparing the measurement result (33.29 W/(m*k)) with data found from the literature (30 W/(m*k)), the agreement verifies the accuracy of the system. This system will be used in future studies to measure thermal conductivity, thermal diffusivity, and thermal boundary conductance of nanoscopic films, layered structures, and other nanostructured materials.

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Daxi Zhang (POC,Primary Presenter), daxi.zhang@aggiemail.usu.edu;






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