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5/16/2017  |   9:35 AM - 10:00 AM   |  1

The application of thermomechanical analysis and thermal conductivity measurements in the field of materials science

The thermomechanical analysis (TMA) includes measuring the sample deformation under certain load or measuring the change in one of the dimensions (shrinkage or expansion) as a function of the temperature. The C-Therm dilatometer is used for for routine characterization and quality control between room temperature and 1600°C, usually for bulks solids like ceramics, polymers, and metals. An example study of semi-metallic break pad will be presented. SetSYS Evo 2400 C TMA is based on a complete modular thermal analysis platform with a vertical design and a preferred system for advanced analysis. In addition to the standard characterization of the mechanical properties of solids (softening, glass transition, degradation, reticulation, coefficient of thermal expansion) under varied stress, it is particularly suitable for powders, which cannot be prepared as tight sintered pellets and soft materials. Several examples, including low temperature (-150 C) thermomechanical measurements, loose copper powders sintering, elasticity of fibers, and controlled sintering of hydroxyapatite will be used to illustrate some of the applications. Thermal conductivity measurement of composite polymers is critical to understanding how new additives and mixing techniques effect base polymers. A highlight on such thermal conductivity data acquired via the single-sided modified transient plane source technique will be presented.

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Kristina Lilova (POC,Primary Presenter), kristina.lilova@setaram.com;
Jarett Nickerson (Co-Presenter), jnickerson@ctherm.com;






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